Title :
Incompatibility Problems in Soldering Technology
Author :
Tersztyánszky, László ; Illés, Balázs
Keywords :
Assembly; Atomic layer deposition; Bismuth; Coatings; Copper; Environmentally friendly manufacturing techniques; Lead; Soldering; Surface finishing; Tin;
Conference_Titel :
Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on
Print_ISBN :
0-7803-9325-2
DOI :
10.1109/ISSE.2005.1491009
