• DocumentCode
    1612531
  • Title

    Optimization of cavity fabrication for micro-fluidic systems

  • Author

    Wang, X.S. ; Balluch, B. ; Smetana, W. ; Stangl, G.

  • Author_Institution
    AEM-Group, Vienna Univ. of Technol., Vienna, Austria
  • fYear
    2008
  • Firstpage
    414
  • Lastpage
    419
  • Abstract
    Processing parameters for an optimized fabrication of micro structures with dimensions ranging from 20 mum to 4 mm channel width and up to 2 mm height providing height/width aspect ratios of 10/1 have been investigated for 3 different LTCC-tapes (low temperature co-fired ceramics). The fabrication process is based on an optimized NdYAG-laser machining process and an adapted isostatic single step lamination method where a remarkable reduction of recommended lamination pressure is conducted successfully, in order to minimize distortions of channel geometry but still providing tightness of laminated LTCC-layers. Different procedures have been tested to improve channel geometry. Consequently different tape-compatible SVM (sacrificial volume materials) have been employed, including liquids working as fillers and adhesives, respectively. The preprocessed structures have been fired in accordance with TGA-optimized (thermo gravimetric analysis) firing profiles which provide a residue-free burnout. This paper summarizes the influence of processing parameters on the final dimensions of various test channel devices.
  • Keywords
    adhesives; ceramics; filler metals; firing (materials); laminations; laser beam machining; microchannel flow; optimisation; thermal analysis; LTCC-tapes; YAG:Nd-laser machining process; adhesives; cavity fabrication; channel geometry; fillers; firing profiles; isostatic single step lamination method; low temperature co-fired ceramics; microfluidic systems; optimization; residue-free burnout; sacrificial volume materials; size 2 mm; size 20 mum to 4 mm; thermo gravimetric analysis; Ceramics; Conducting materials; Fabrication; Geometry; Lamination; Machining; Optimization methods; Support vector machines; Temperature distribution; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
  • Conference_Location
    Budapest
  • Print_ISBN
    978-1-4244-3972-0
  • Electronic_ISBN
    978-1-4244-3974-4
  • Type

    conf

  • DOI
    10.1109/ISSE.2008.5276640
  • Filename
    5276640