• DocumentCode
    1612541
  • Title

    Investigate heat conduction ability of power components with Dijsktra Algorithm

  • Author

    Illés, Balázs ; Harsányi, Gábor

  • Author_Institution
    Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary
  • fYear
    2008
  • Firstpage
    420
  • Lastpage
    425
  • Abstract
    In this paper we present that how the graph theory can be used in the field of thermal study. We have developed a method which can describe the heat conduction ability of large size power components during the reflow soldering. Our method exploit that the heat conduction ability of the materials can be described with time coefficients which is determined by the thermal resistance and the heat capacity of the given material. We implemented this in a Matlab program which generates a directed and weighted graph from the discrete thermal model of the investigated component. The program uses the Dijsktra Algorithm to find the shortest "conduction ways" between the different parts of the component. With our method, the following effects can be studied during the soldering: the deviation between the generated conduction heat flows from the different faces of the component, from which direction and way get a chosen point the most heat, the effect of heat distraction, etc...
  • Keywords
    graph theory; reflow soldering; thermal management (packaging); thermal resistance; Dijsktra algorithm; discrete thermal model; graph theory; heat capacity; heat conduction; power components; reflow soldering; thermal resistance; Assembly; Conducting materials; Manufacturing processes; Ovens; Reflow soldering; Resistance heating; Semiconductor device modeling; Surface-mount technology; Temperature distribution; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
  • Conference_Location
    Budapest
  • Print_ISBN
    978-1-4244-3972-0
  • Electronic_ISBN
    978-1-4244-3974-4
  • Type

    conf

  • DOI
    10.1109/ISSE.2008.5276641
  • Filename
    5276641