DocumentCode
1612541
Title
Investigate heat conduction ability of power components with Dijsktra Algorithm
Author
Illés, Balázs ; Harsányi, Gábor
Author_Institution
Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary
fYear
2008
Firstpage
420
Lastpage
425
Abstract
In this paper we present that how the graph theory can be used in the field of thermal study. We have developed a method which can describe the heat conduction ability of large size power components during the reflow soldering. Our method exploit that the heat conduction ability of the materials can be described with time coefficients which is determined by the thermal resistance and the heat capacity of the given material. We implemented this in a Matlab program which generates a directed and weighted graph from the discrete thermal model of the investigated component. The program uses the Dijsktra Algorithm to find the shortest "conduction ways" between the different parts of the component. With our method, the following effects can be studied during the soldering: the deviation between the generated conduction heat flows from the different faces of the component, from which direction and way get a chosen point the most heat, the effect of heat distraction, etc...
Keywords
graph theory; reflow soldering; thermal management (packaging); thermal resistance; Dijsktra algorithm; discrete thermal model; graph theory; heat capacity; heat conduction; power components; reflow soldering; thermal resistance; Assembly; Conducting materials; Manufacturing processes; Ovens; Reflow soldering; Resistance heating; Semiconductor device modeling; Surface-mount technology; Temperature distribution; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
Conference_Location
Budapest
Print_ISBN
978-1-4244-3972-0
Electronic_ISBN
978-1-4244-3974-4
Type
conf
DOI
10.1109/ISSE.2008.5276641
Filename
5276641
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