Electrically conductive adhesives as vias fill in PCBs: the influence of fill shape and contact metallization on vias resistance stability

Author

Kisiel, R. ; Borecki, J. ; Felba, J. ; Moscicki, A.

Author_Institution

Inst. of Microelectron. & Optoelectron., Warsaw Univ. of Technol.

fYear

0

Firstpage

207

Lastpage

212

Abstract

Isotropic conductive adhesives (ICAs) can be used to realize joints in SMT assembly or inner PCBs interconnections. The ALIVH technology is an example of applying the ICAs for PCB fabrication. Simpler application is the idea of "metallization" of mechanically drilled holes in double-sided PCBs with ICAs. Such possibility was presented in previous papers; the average measured fill resistance for vias of diameter 0.8 mm was below 50 mOmega. One of the critical parameters of adhesives is their resistance stability during temperature humidity tests and the aim of the paper is to present the results of such testing. It was found, that for some fill shape and Ni/Au contact metallization the fill resistance is below 50 mOmega for holes diameter 0.5 mm and fill resistance changes after the temperature/humidity tests do not exceed few percent

Keywords

adhesives; gold alloys; interconnections; metallisation; nickel alloys; printed circuit manufacture; surface mount technology; 0.5 mm; 0.8 mm; ALIVH technology; Ni-Au; PCB interconnections; SMT assembly; contact metallization; electrically conductive adhesives; fill resistance; fill shape; isotropic conductive adhesives; printed circuit boards; surface mount technology; temperature humidity tests; via fill; vias resistance stability; Conductive adhesives; Contact resistance; Electric resistance; Humidity; Independent component analysis; Metallization; Shape; Stability; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on

Conference_Location

Wiener Neustadt

Print_ISBN

0-7803-9325-2

Type

conf

DOI

10.1109/ISSE.2005.1491028

Filename

1491028