Title :
Optimization of printed circuit board design assembly using yield prediction
Author_Institution :
Dept. of Technol. & Meas., Univ. of West Bohemia, Pilsen, Czech Republic
Abstract :
The paper deals with optimization of printed circuit board design using yield prediction. Yield prediction of PCB assembly process can be obtained from the below presented yield model. The model is based on a combination of elements from two most used yield prediction methodologies, namely: process yield and board design yield. Due to PCB assembly process yield prediction is possible not only to assist the manufacturers in determining reliable estimates of production capabilities, but also to optimize PCB design process.
Keywords :
assembling; circuit optimisation; printed circuit design; printed circuit manufacture; yield strength; PCB manufacturers; circuit optimization; printed circuit board design assembly; yield prediction; Assembly; Design optimization; Environmentally friendly manufacturing techniques; Manufacturing processes; Packaging; Predictive models; Printed circuits; Process design; Production; Yield estimation;
Conference_Titel :
Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
Conference_Location :
Budapest
Print_ISBN :
978-1-4244-3972-0
Electronic_ISBN :
978-1-4244-3974-4
DOI :
10.1109/ISSE.2008.5276662
