Optimization of printed circuit board design assembly using yield prediction

The paper deals with optimization of printed circuit board design using yield prediction. Yield prediction of PCB assembly process can be obtained from the below presented yield model. The model is based on a combination of elements from two most used yield prediction methodologies, namely: process yield and board design yield. Due to PCB assembly process yield prediction is possible not only to assist the manufacturers in determining reliable estimates of production capabilities, but also to optimize PCB design process.