Access to microsystem technology: the CMP services solution

CMP aims at providing Universities, Research Laboratories and Industries with the possibility to have their integrated circuits projects fabricated for prototyping and low volume production. Presently, users are serviced for CMOS double layer poly/double layer metal (DLP/DLM) 0.8 μ, DLM/TLM 0.6 μ, DLP/4LM 0.35 μ, SLP/6LM 0.18 μ and 0.12 μ, BiCMOS DLP/DLM 0.8 μ, SiGe BiCMOS DLP/DLM 0.8 μ and 5 LM 0.35 μ, and HEMT GaAs 0.2 μ. About 40 multi-project runs are offered per year. Micro Electro Mechanical Systems (MEMS) are provided in standard CMP runs in CMOS DLP/DLM 0.8 μm and DLM/TLM 0.6 μ, BiCMOS DLP/DLM 0.8 μ and HEMT GaAs 0.2 μ, using compatible front-side bulk micro-machining. MUMPS process is offered as a surface micro-machining allowing one to integrate MEMS only microstructures. This paper describes the services available, focusing on the most advanced IC processes and on the MEMS processes.