Optimization of virtual investigation methods in thermal management of electronic assemblies

In design of high performance electronic assemblies, virtual thermal management and virtual thermal investigation based on specific CAD programs, which can offer optimum or close to optimum solutions, has become a paramount approach in order to obtain, from the first design and manufacturing flow, good working products. The question mark that appears sometimes is in direct link with the main problem of all CAD simulations, especially with those that present, as final result, colored maps: "is the nice result in accordance with practice?" or "can the nice result predict the real working of the product/assembly?". The task of authors is to describe a method for optimization of virtual investigation in thermal management of electronic assemblies based both on thermal simulation and practical non-contact measurements