DocumentCode :
1613178
Title :
Reliability of microsystems from the material point of view
Author :
Villain, J. ; Steinberger, H.
Author_Institution :
Fac. of Electr. Eng., Univ. of Appl. Sci. Augsburg, Germany
Volume :
1
fYear :
2002
fDate :
6/24/1905 12:00:00 AM
Firstpage :
75
Abstract :
The determination of the reliability of microsystems is very important from the customer satisfaction perspective. The reliability of electromechanical components is determined by using mechanical tests, metallographic investigations, nondestructive testing and corrosion tests. All tests are accelerated tests which determine the behaviour of a component or a system during hours, days or weeks with regard to their lifetime and are well known. The behaviour of these components under working conditions confirm the test results if the chosen tests characterise the real loads. In addition to the accelerated reliability tests, more and more simulation tools are used to optimise the design of a given component in order to reduce the costs and the time of development and testing and to increase the lifetime and reliability. To determine the thermo mechanical reliability, i.e. to reduce the mechanical stresses, which are mainly responsible for cracks under working conditions, stress-strain diagrams depending on temperature and strain velocity are urgently needed. The paper describes the necessity of material parameters which characterise the material under working conditions to obtain simulation results with high accuracy. However in microsystems the materials parameters as described are not known exactly at present.
Keywords :
crack-edge stress field analysis; life testing; mechanical testing; micromechanical devices; nondestructive testing; semiconductor device models; semiconductor device reliability; semiconductor device testing; stress-strain relations; accelerated tests; component lifetime; corrosion tests; cracks; customer satisfaction; design optimisation; development costs; development time; electromechanical components; material parameters; materials perspective; mechanical stresses; mechanical tests; metallographic testing; microsystems materials parameters; microsystems reliability; nondestructive testing; reliability tests; simulation; simulation tools; strain velocity; stress-strain diagrams; thermo mechanical reliability; working conditions; Corrosion; Cost function; Customer satisfaction; Design optimization; Employee welfare; Life estimation; Life testing; Materials reliability; Nondestructive testing; System testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics, 2002. MIEL 2002. 23rd International Conference on
Print_ISBN :
0-7803-7235-2
Type :
conf
DOI :
10.1109/MIEL.2002.1003151
Filename :
1003151
Link To Document :
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