Title :
The impact of manufacturing issues above lead free soldering alloys
Author :
Avram, Adrian ; Carstea, Horia ; Tanase, Mihail ; Lie, Ioan ; Babaita, Mircea
Author_Institution :
Dept. of Appl. Electron., "Politehnica" Univ. of Timisoara
Abstract :
Practically all microelectronic assemblies in use today utilize Pb-Sn solders for interconnection. With the advent of chip scale packaging technologies, the usage of solder connections has increased. The most widely used Pb-Sn solder has the eutectic composition. Emerging environmental regulations worldwide, most notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has made the search for suitable "Pb-free" solders an important issue for microelectronics assembly
Keywords :
chip scale packaging; integrated circuit manufacture; lead alloys; microassembling; soldering; solders; tin alloys; chip scale packaging technologies; environmental regulations; eutectic solder alloys; interconnection; lead free soldering alloys; manufacturing issues; microelectronic assemblies; solder connections; Assembly; Blood; Consumer electronics; Electronics industry; Environmentally friendly manufacturing techniques; Humans; Lead; Microelectronics; Occupational safety; Soldering;
Conference_Titel :
Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on
Conference_Location :
Wiener Neustadt
Print_ISBN :
0-7803-9325-2
DOI :
10.1109/ISSE.2005.1491043
