• DocumentCode
    1613591
  • Title

    Thermal model of power semiconductor devices for electro-thermal circuit simulations

  • Author

    Igic, P.M. ; Mawby, P.A. ; Towers, M.S. ; Batcup, S.

  • Author_Institution
    Power Electron. Design Centre, Univ. Coll. of Swansea, UK
  • Volume
    1
  • fYear
    2002
  • fDate
    6/24/1905 12:00:00 AM
  • Firstpage
    171
  • Abstract
    An electro-thermal (ET) strategy used for ET circuit simulations is described in this paper. An original program for a MATLAB environment based on a deconvolution method is written and used for a determination of the RC dynamic thermal network parameters. An excellent agreement is obtained between experimental thermal transient response function of the device for a step function excitation and simulated one obtained using corresponding RC thermal network.
  • Keywords
    circuit simulation; deconvolution; power semiconductor devices; semiconductor device models; thermal analysis; transient response; ET circuit simulations; MATLAB environment; RC dynamic thermal network; deconvolution method; electro-thermal strategy; power semiconductor devices; step function excitation; thermal model; thermal network parameters; thermal transient response function; Circuit simulation; Computational modeling; Deconvolution; Electronic packaging thermal management; Equations; MOSFET circuits; Mathematical model; Power semiconductor devices; Temperature; Transient response;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics, 2002. MIEL 2002. 23rd International Conference on
  • Print_ISBN
    0-7803-7235-2
  • Type

    conf

  • DOI
    10.1109/MIEL.2002.1003167
  • Filename
    1003167