• DocumentCode
    1613786
  • Title

    Physical design and technology parameters for vertical system-in-package integration

  • Author

    Polityko, David Dmitry ; Guttowski, Stephan ; John, Werner ; Reichl, Herbert

  • fYear
    2005
  • Firstpage
    413
  • Lastpage
    419
  • Keywords
    Integrated circuit interconnections; Monolithic integrated circuits; Packaging; Propagation delay; Routing; Substrates; System-on-a-chip; Transistors; Wires; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on
  • Print_ISBN
    0-7803-9325-2
  • Type

    conf

  • DOI
    10.1109/ISSE.2005.1491064
  • Filename
    1491064
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1613786