Title :
Session 14: packaging related failure mechanisms
Abstract :
Start of the above-titled section of the conference proceedings record.
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2004. IPFA 2004. Proceedings of the 11th International Symposium on the
Conference_Location :
Taiwan
Print_ISBN :
0-7803-8454-7
DOI :
10.1109/IPFA.2004.1345601
