Interface microstructure evolution of lead-free solder on Ni-based under bump metallizations during reflow and high temperature storage

Author

Tung, Chih Hang ; Teo, Poi Siong ; Lee, Charles

Author_Institution

Inst. of Microelectron., Singapore, Singapore

fYear

2004

Firstpage

225

Lastpage

228

Abstract

The interface microstructure evolution between SnCuAg lead-free solder and Ni-based alloys under bump metallization (UBM) systems are studied using transmission electron microscopy (TEM). Details on microstructure changes during reflow process and high temperature storage have help to understand some of the reliability concerns on using Pb-free solder in flip-chip packaging technology.

Keywords

copper alloys; crystal microstructure; flip-chip devices; integrated circuit metallisation; integrated circuit packaging; integrated circuit reliability; interface structure; microassembling; nickel alloys; reflow soldering; silver alloys; tin alloys; transmission electron microscopy; Ni; Ni-based under bump metallizations; Pb-free solder; SnCuAg; SnCuAg lead-free solder; TEM; UBM; flip-chip packaging technology; high temperature storage; interface microstructure evolution; microstructure changes; reliability concerns; solder reflow; transmission electron microscopy; Artificial intelligence; Electrons; Environmentally friendly manufacturing techniques; Lead; Metallization; Microelectronics; Microstructure; Packaging; Temperature sensors; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits, 2004. IPFA 2004. Proceedings of the 11th International Symposium on the

Print_ISBN

0-7803-8454-7

Type

conf

DOI

10.1109/IPFA.2004.1345604

Filename

1345604