Title :
Wave soldering process for lead free solders - a modelling study using computational fluid dynamics
Author :
Stoyanov, S. ; Gwyer, D. ; Bailey, C. ; Saxena, N. ; Adams, S.
Author_Institution :
Sch. of Comput. & Math. Sci., Greenwich Univ., London
Abstract :
Nitrogen is now used in wave soldering machines to help lower the amount of dross that can be formed on the solder bath surface. This paper provides details on the use of computational fluid dynamics (CFD) in helping understand the flow profiles of nitrogen in a wave soldering machine and to predict the concentration of nitrogen and oxygen around the solder bath
Keywords :
computational fluid dynamics; nitrogen; oxygen; soldering equipment; solders; wave soldering; CFD; computational fluid dynamics; lead free solders; nitrogen flow profile; solder bath surface; wave soldering machine; wave soldering process; Computational fluid dynamics; Computational modeling; Environmentally friendly manufacturing techniques; Fluid flow; Furnaces; Lead; Nitrogen; Soldering; Surface waves; Temperature;
Conference_Titel :
Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on
Conference_Location :
Wiener Neustadt
Print_ISBN :
0-7803-9325-2
DOI :
10.1109/ISSE.2005.1491075
