• DocumentCode
    1614208
  • Title

    Constructing a robust overlay for digital ecosystems

  • Author

    Liu, Meirong ; Koskela, Timo ; Ylianttila, Mika

  • Author_Institution
    Inf. Process. Lab., Univ. of Oulu, Oulu, Finland
  • fYear
    2009
  • Firstpage
    430
  • Lastpage
    435
  • Abstract
    The Digital Ecosystem (DE) initiative aims to encourage Small and Medium-sized Enterprises (SMEs) to collaborate with each other by make full use of the resources distributed in the network. The interconnection among the heterogeneous companies, users, and resources forms a complex and dynamic network environment. In the real-life applications, specific solutions are required for organizing the DE networks to make the DE networks robust and easy to adopt. Peer-to-peer (P2P) paradigm is suited to DE networks due to its high quality of scalability, self-organization and adaptation. In this paper, by exploring the heterogeneity of the devices in DE, we present a robust and adaptive super-peer based algorithm (RASP) to build and manage the dynamic DE overlay network. In addition, a collaboration scenario between devices in the DE, based on super-peer overlay, is demonstrated. Finally, the experimental results show that RASP can efficiently manage the devices in the DE overlay and is robust to the leave and join of the digital devices and failure of super-peers.
  • Keywords
    peer-to-peer computing; small-to-medium enterprises; adaptive super-peer based algorithm; digital ecosystem overlay network; peer-to-peer paradigm; small and medium-sized enterprises; Companies; Ecosystems; Electronic mail; Information processing; International collaboration; Laboratories; Large-scale systems; Peer to peer computing; Robustness; Topology; digital ecosystem; overlay topology; peer-to-peer; robustness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Digital Ecosystems and Technologies, 2009. DEST '09. 3rd IEEE International Conference on
  • Conference_Location
    Istanbul
  • Print_ISBN
    978-1-4244-2345-3
  • Electronic_ISBN
    978-1-4244-2346-0
  • Type

    conf

  • DOI
    10.1109/DEST.2009.5276711
  • Filename
    5276711