Title :
A review of laser induced techniques for microelectronic failure analysis
Author :
Phang, J.C.H. ; Chan, D.S.H. ; Palaniappan, M. ; Chin, J.M. ; Davis, B. ; Bruce, M. ; Wilcox, J. ; Gilfeather, G. ; Chua, C.M. ; Koh, L.S. ; Ng, H.Y. ; Tan, S.H.
Author_Institution :
Centre for Integrated Circuit Failure Anal. & Reliability, Nat. Univ. of Singapore, Singapore
Abstract :
Recent developments have seen the use of scanning focused near infra-red (NIR) laser beams for fault localization and defect characterization in microelectronic failure analysis. Fault localization techniques are based on thermal stimulation and include power alteration techniques such as OBIRCH, TIVA, SEI, and tester based techniques such as RIL-SDL. Defect characterization techniques are based on carrier stimulation and include OBIC, SCOBIC and LIVA. A review of the concepts and application of these techniques together with the instrumentation requirements to effectively deploy these techniques are presented in this paper.
Keywords :
OBIC; Seebeck effect; failure analysis; fault location; integrated circuit interconnections; integrated circuit testing; laser beam applications; laser beam effects; reviews; LIVA; OBIC; OBIRCH; RIL-SDL; SCOBIC; SEI; Seebeck effect imaging; TIVA; defect characterization; defect characterization techniques; fault localization; instrumentation requirements; laser induced microelectronic failure analysis techniques; light induced voltage alteration; microelectronic failure analysis; optical beam induced current; optical beam induced resistance change; power alteration techniques; resistive interconnection localization; review; scanning focused near infra-red laser beams; single contact optical beam induced current; soft defect localization; tester based techniques; thermal stimulation; thermally induced voltage alteration; Circuit faults; Doping; Failure analysis; Instruments; Integrated circuit reliability; Laser beams; Microelectronics; Microscopy; Power lasers; Surface emitting lasers;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2004. IPFA 2004. Proceedings of the 11th International Symposium on the
Print_ISBN :
0-7803-8454-7
DOI :
10.1109/IPFA.2004.1345617
