Title :
Table of contents
Abstract :
The following topics are dealt with: advanced semiconductor manufacturing; wafer processing and manufacturing; defect inspection; advanced process control; design for manufacturability and lithography; contamination free manufacturing; reducing cost and maximizing equipment productivity; advanced processes and materials; yield enhancement/methodologies; fab optimization; and advanced metrology.
Keywords :
cost reduction; design for manufacture; environmental factors; lithography; measurement; process control; productivity; semiconductor industry; wafer-scale integration; advanced metrology; advanced process control; advanced semiconductor manufacturing; contamination free manufacturing; cost reduction; defect inspection; design for manufacturability; fab optimization; lithography; maximizing equipment productivity; wafer manufacturing; wafer processing; yield enhancement; yield methodology;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2010 IEEE/SEMI
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-6517-0
DOI :
10.1109/ASMC.2010.5551407
