Advances in magnetic-based current imaging for high resistance defects and sub-micron resolution

Author

Knauss, L.A. ; Orozco, Alvaro ; Woods, S.I.

Author_Institution

Neocera, Inc., Beltsville, MD, USA

fYear

2004

Firstpage

267

Lastpage

270

Abstract

For several years, magnetic-based current imaging has been used to localize current leakages and shorts by imaging currents in integrated circuits and packages. Recent advances have enabled this technology to be extended to localizing high resistance defects in packages to within 30 μm, an order of magnitude better than time-domain reflectometry. This is done in a non-contact, non-destructive way. For die-level applications, advances have been made to enable this technology to achieve < 300 nm resolution.

Keywords

SQUIDs; electric resistance; fault location; image resolution; integrated circuit packaging; integrated circuit testing; leakage currents; magnetic sensors; magnetoresistive devices; nondestructive testing; short-circuit currents; SQUID; current leakage localization; die-level applications; high resistance defects; imaging resolution; integrated circuits; magnetic-based current imaging; magnetoresistive sensors; noncontact nondestructive method; packages; sub-micron resolution; time-domain reflectometry; High-resolution imaging; Image resolution; Isolation technology; Magnetic fields; Magnetic sensors; Magnetoresistance; Optical imaging; SQUIDs; Semiconductor device packaging; Superconducting magnets;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits, 2004. IPFA 2004. Proceedings of the 11th International Symposium on the

Print_ISBN

0-7803-8454-7

Type

conf

DOI

10.1109/IPFA.2004.1345620

Filename

1345620