DocumentCode :
1614729
Title :
Outgassing characterization of elastomeric seals used in semiconductor wafer processing
Author :
Heller, Mark J. ; Sogo, Shinichi ; Chen, Joe ; Legare, John
Author_Institution :
E. I. du Pont de Nemours & Co., Newark, DE, USA
fYear :
2010
Firstpage :
68
Lastpage :
71
Abstract :
High or ultra-high vacuum (UHV) processes for integrated circuit manufacturing require close control of vacuum levels and uniform gas composition in the chamber in order to insure optimum process efficiency, product uniformity and product consistency. Outgassing from elastomeric seals can affect both vacuum level and consistency. A test methodology has been developed using a residual gas analyzer to measure the outgassing properties of elastomers. This paper compares the outgassing characteristics of three different types of elastomeric seals (perfluo-roelastomers, fluoroelastomers and silicones) typically used in semiconductor wafer processing using this test method. Data on outgassing rate as a function of time and temperature are presented. While perfluoroelastomers as a material class exhibit the lowest outgassing rate at elevated temperatures, there are some performance variations depending on formulation and compounding.
Keywords :
elastomers; integrated circuit manufacture; outgassing; seals (stoppers); UHV process; elastomeric seal; fluoroelastomer; integrated circuit manufacturing; outgassing characterization; perfluoroelastomer; residual gas analyzer; semiconductor wafer processing; silicone; ultra-high vacuum process; Heating; Materials; Seals; Temperature distribution; Temperature measurement; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2010 IEEE/SEMI
Conference_Location :
San Francisco, CA
ISSN :
1078-8743
Print_ISBN :
978-1-4244-6517-0
Type :
conf
DOI :
10.1109/ASMC.2010.5551420
Filename :
5551420
Link To Document :
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