DocumentCode :
1614781
Title :
Process tool cleanliness for clean manufacturing
Author :
Chia, V.K.F.
Author_Institution :
Balazs Nano Anal., Fremont, CA, USA
fYear :
2010
Firstpage :
79
Lastpage :
83
Abstract :
Wafer tool cleanliness specifications are generally accepted for various processes and technology nodes. However, the material and component cleanliness required to meet these wafer tool cleanliness is vague. One reason is the lack of uniformly accepted parts cleanliness tests. This paper reviews and recommends test methods for determining the cleanliness of coupons, first articles and production parts.
Keywords :
cleaning; hygiene; semiconductor device manufacture; surface contamination; clean manufacturing; component cleanliness; coupon cleanliness; material cleanliness; part surface contamination; process tool cleanliness; wafer tool cleanliness specifications; Cleaning; Compounds; Materials; Metals; Surface contamination; Surface treatment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2010 IEEE/SEMI
Conference_Location :
San Francisco, CA
ISSN :
1078-8743
Print_ISBN :
978-1-4244-6517-0
Type :
conf
DOI :
10.1109/ASMC.2010.5551422
Filename :
5551422
Link To Document :
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