Title :
Process tool cleanliness for clean manufacturing
Author_Institution :
Balazs Nano Anal., Fremont, CA, USA
Abstract :
Wafer tool cleanliness specifications are generally accepted for various processes and technology nodes. However, the material and component cleanliness required to meet these wafer tool cleanliness is vague. One reason is the lack of uniformly accepted parts cleanliness tests. This paper reviews and recommends test methods for determining the cleanliness of coupons, first articles and production parts.
Keywords :
cleaning; hygiene; semiconductor device manufacture; surface contamination; clean manufacturing; component cleanliness; coupon cleanliness; material cleanliness; part surface contamination; process tool cleanliness; wafer tool cleanliness specifications; Cleaning; Compounds; Materials; Metals; Surface contamination; Surface treatment;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2010 IEEE/SEMI
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-6517-0
DOI :
10.1109/ASMC.2010.5551422