Reductions in power noise and system area burden using wireless power transfer scheme in 3D package

Author

Eunseok Song ; Hongseok Kim ; Kim, Jonghoon J. ; Chiuk Song ; Hyunsuk Lee ; Joungho Kim

Author_Institution

Dept. of Electr. Eng., KAIST, Daejeon, South Korea

fYear

2014

fDate

8-9 May 2014

Firstpage

178

Lastpage

181

Abstract

Design challenges in 3D packages, which represent a system bandwidth of Tera Byte/sec, include serious SSN and large system area burden. For overcoming such design challenges, a package-level WPT scheme is proposed. Also, a proper inductor structure for 3D packages is proposed and verified through measuring the power efficiency of the WPT scheme according to inductor types. The WPT scheme in 3D packages that uses magnetic field resonance shows a noise filtering characteristic that significantly reduces power noise. In addition, the WPT system can reduce system area burden, as we can get rid of power interconnections, such as power balls and power TSVs, in 3D package/ICs based on its WPT scheme.

Keywords

electronics packaging; magnetic fields; 3D packages; SSN; design challenges; inductor types; magnetic field resonance; noise filtering characteristic; package-level WPT scheme; power noise reductions; system area burden reductions; wireless power transfer scheme; Bandwidth; Inductors; Magnetic field measurement; Noise; Pins; Three-dimensional displays; Voltage measurement; 3D package; inductor design; magnetic field resonance; power efficiency; power noise; system area burden; wireless power transfer;

fLanguage

English

Publisher

ieee

Conference_Titel

Wireless Power Transfer Conference (WPTC), 2014 IEEE

Conference_Location

Jeju

Type

conf

DOI

10.1109/WPT.2014.6839576

Filename

6839576