Title :
Identification of yield loss sources in the outer dies using SEM based wafer bevel review
Author :
Becker, Britta ; Porat, Ronnie ; Eschwege, Hanan
Author_Institution :
Appl. Mater., Dresden, Germany
Abstract :
This paper describes a methodology for defect review and process monitoring on wafer´s upper bevel and apex. A case study gives an example of successful application.
Keywords :
process monitoring; scanning electron microscopy; wafer bonding; SEM; defect review; outer dies; process monitoring; wafer bevel review; yield loss sources; Adaptive optics; Book reviews; Image edge detection; Monitoring; Optical imaging; Scanning electron microscopy;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2010 IEEE/SEMI
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-6517-0
DOI :
10.1109/ASMC.2010.5551435
