DocumentCode
1615509
Title
VOC induced particle generation during wafer transportation and its solution
Author
Okazaki, Motoya ; Niehoff, Sharon ; Alkurjy, Ninos ; Cai, Cathy ; Ngai, Chris ; Richtsteiger, Petra ; Bounouar, Julien
Author_Institution
Appl. Mater., Inc., Santa Clara, CA, USA
fYear
2010
Firstpage
196
Lastpage
199
Abstract
In this paper, we describe a particle generation issue on 300 mm wafers during wafer shipping and transportation while using a FOSB (Front Opening Shipping Box) for the wafer shipping container. The analysis work associated with this defect generation issue and its prevention scheme will also be discussed.
Keywords
containers; goods distribution; organic compounds; semiconductor materials; surface contamination; FOSB; VOC induced particle generation; front opening shipping box; volatile organic compounds; wafer shipping; wafer transportation; Adders; Air transportation; Atmospheric measurements; Pollution measurement; Semiconductor device measurement; Shape; FOSB; VOC; particles; transportation; wafer;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference (ASMC), 2010 IEEE/SEMI
Conference_Location
San Francisco, CA
ISSN
1078-8743
Print_ISBN
978-1-4244-6517-0
Type
conf
DOI
10.1109/ASMC.2010.5551451
Filename
5551451
Link To Document