Title :
Novel thin film polymer foaming technique for low and ultra low-k dielectrics
Author :
Krause, B. ; Koops, G.H. ; van der Vegt, N.F.A. ; Wessling, M. ; Wübbenhorst, M. ; van Turnhout, J.
Author_Institution :
Membrane Technol. Group, Twente Univ., Enschede, Netherlands
fDate :
6/23/1905 12:00:00 AM
Abstract :
The results presented show a novel route for the preparation of thin ultra-low-k polymer films based on commercial and "non-exotic" (non-expensive) polyimide by a foaming technique. Dependent on the glass transition temperature of the polyimide mechanically and thermally stable (> 300 °C) films having porosities of ca. 40 % and k-values below 2.0 are formed. A further reduction into the ultra low k region may be accomplished by tailoring the shape of the pores from spherical into disc-like voids
Keywords :
dielectric thin films; foams; glass transition; noncrystalline defects; organic insulating materials; permittivity; polymer films; porosity; quenching (thermal); thermal stability; voids (solid); 300 degC; disc-like voids; glass transition temperature; mechanically stable films; polymer films; polymer foaming technique; porosities; thermally stable films; ultra low-k dielectrics; Carbon dioxide; Chemicals; Dielectric constant; Dielectric materials; Dielectric thin films; Glass; Polymer films; Polymer foams; Temperature; Thermal decomposition;
Conference_Titel :
Solid Dielectrics, 2001. ICSD '01. Proceedings of the 2001 IEEE 7th International Conference on
Conference_Location :
Eindhoven
Print_ISBN :
0-7803-6352-3
DOI :
10.1109/ICSD.2001.955585
