Title :
A 342mW mobile application processor with full-HD multi-standard video codec
Author :
Iwata, Keiji ; Irita, T. ; Mochizuki, Sho ; Ueda, Hiroshi ; Ehama, M. ; Kimura, Mizue ; Takemura, J. ; Matsumoto, Kaname ; Yamamoto, Eiji ; Teranuma, T. ; Takakubo, K. ; Watanabe, Hiromi ; Yoshioka, Shohei ; Hattori, Toshihiro
Author_Institution :
Renesas Technol., Tokyo
Abstract :
Today´s cellular phones must support full high-definition (full-HD) video in multiple video formats, such as H.264 and MPEG-2/-4, with low power consumption. Full-HD video processing requires six times the data bandwidth and is more computationally intensive than conventional standard-definition (SD) video. The trade-off between flexibility, performance and power consumption is a key focus of video-codec design. Homogeneous multi-core processors are power-consuming and achieving high-throughput is difficult. While dedicated circuits can minimize power consumption, the dedicated decoders and encoders in previous reports have difficulty performing all of the media processing that is indispensable for a modern cellular phone. In this paper, we have integrated a mobile application processor featuring a two-stage-processing video codec, tile-based address-translation circuits, and several audio/visual intellectual property (IP) modules. The circuit diagram and visualization are also illustrated.
Keywords :
industrial property; microprocessor chips; video codecs; H.264; MPEG-2-4; audio-visual intellectual property module; cellular phone; data bandwidth; full-HD multistandard video codec; high-definition video; homogeneous multicore processor; low power consumption; media processing; mobile application processor; multiple video format; power 342 mW; tile-based address-translation circuit; video processing; Bandwidth; Cellular phones; Circuits; Decoding; Energy consumption; High definition video; Intellectual property; Multicore processing; Video codecs; Visualization;
Conference_Titel :
Solid-State Circuits Conference - Digest of Technical Papers, 2009. ISSCC 2009. IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-3458-9
DOI :
10.1109/ISSCC.2009.4977356