Title :
Printed circuit board recycling: a state-of-art survey
Author :
Gao, Zong ; Li, Jianzhi ; Zhang, Hong C.
Author_Institution :
Dept. of Ind. Eng., Texas Tech. Univ., Lubbock, TX, USA
fDate :
6/24/1905 12:00:00 AM
Abstract :
This survey is conducted with the intention of providing a clear and comprehensive review of the current situation in PCB recycling field as a reference and guideline for research and implementation. Original information is collected from both the PCB recycling companies in the United States and quantities of articles published after 1990. Both the industrial applied methods and ongoing laboratory research are evaluated in this paper.
Keywords :
printed circuits; recycling; PCB recycling; PCB recycling companies; PCB recycling methods; auto-disassembly; disassembly; dismantling; eddy current separation; hydrometallurgical processing; industrial applied methods; laboratory research; material composition; printed circuit board recycling; pyrolysis; pyrometallurgical process; semi-auto-disassembly; top blowing reactor; Ceramics; Composite materials; Consumer electronics; Copper; Gold; Inorganic materials; Laminates; Printed circuits; Recycling; Substrates;
Conference_Titel :
Electronics and the Environment, 2002 IEEE International Symposium on
Print_ISBN :
0-7803-7214-X
DOI :
10.1109/ISEE.2002.1003272
