DocumentCode :
1616269
Title :
A development of highly miniaturized on-chip passive components employing periodically arrayed ground structure for application to radio frequency integrated circuit (RFIC)
Author :
Ju, Jeong-Gab ; Jeong, Jang-hyeon ; Jang, Eui-Hoon ; Han, Sung-Jo ; Yun, Young
Author_Institution :
Dept. of Radio Sci. & Eng., Korea Maritime Univ., Busan, South Korea
fYear :
2011
Firstpage :
1734
Lastpage :
1737
Abstract :
In this paper, using a coplanar waveguide employing periodically arrayed ground structure (PAGS) on silicon substrate, highly miniaturized passive components were developed. Concretely, multi-section transformer, 90° hybrid coupler and ring hybrid coupler were highly miniaturized compared with conventional ones. The passive components showed good RF performances over broadband.
Keywords :
elemental semiconductors; radiofrequency integrated circuits; silicon; transformers; 90° hybrid coupler; RF performances; RFIC; Si; highly miniaturized on-chip passive components; multisection transformer; periodically arrayed ground structure; radio frequency integrated circuit; ring hybrid coupler; Coplanar waveguides; Couplers; Impedance; Insertion loss; Radio frequency; Silicon; Substrates; 90° hybrid coupler; Coplanar waveguide; Passive component; multi-section transformer; ring hybrid coupler;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference Proceedings (APMC), 2011 Asia-Pacific
Conference_Location :
Melbourne, VIC
Print_ISBN :
978-1-4577-2034-5
Type :
conf
Filename :
6174105
Link To Document :
بازگشت