• DocumentCode
    161667
  • Title

    Scaling properties of perpendicular MTJ with dual-CoFeB/MgO interfaces and step-etch structure

  • Author

    Cheng-Wei Chien ; Ding-Yeong Wang ; Sheng-Huang Huang ; Kuei-Hung Shen ; Shan-Yi Yang ; Jia-Hong Shyu ; Keng-Ming Kuo ; Young-Shying Chen ; Yung-Hung Wang ; Tzu-Kun Ku ; Deng, Dennis

  • Author_Institution
    Ind. Technol. Res. Inst., Hsinchu, Taiwan
  • fYear
    2014
  • fDate
    28-30 April 2014
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    We had built and studied the size scaling effect of perpendicular magnetic tunnel junctions (p-MTJs) with dual MgO/CoFeB interface and step-etch structure. Although the spin-torque-transfer (STT) switching current reduces with MTJ area, the current density increases. Our micromagnetic simulations verify that this is an intrinsic property of STT switching. The switching mode shifts gradually from coherent switching in small junctions to incoherent in large junctions. The energy density of coherent switching is higher and demands higher spin current density. At same current density, smaller size takes longer time to switch. Fortunately, the write efficiency (Δ/Isw) is higher for smaller MTJ.
  • Keywords
    cobalt compounds; current density; etching; iron compounds; magnesium compounds; magnetic tunnelling; magnetoelectronics; micromagnetics; perpendicular magnetic anisotropy; CoFeB-MgO; STT switching intrinsic property; coherent switching; micromagnetic simulations; perpendicular MTJ; perpendicular magnetic tunnel junctions; scaling property; size scaling effect; spin current density; spin-torque-transfer switching current; step-etch structure; switching mode shifts; write efficiency; Current density; Junctions; Magnetic tunneling; Stability analysis; Switches; Thermal factors; Thermal stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, Systems and Application (VLSI-TSA), Proceedings of Technical Program - 2014 International Symposium on
  • Conference_Location
    Hsinchu
  • Type

    conf

  • DOI
    10.1109/VLSI-TSA.2014.6839662
  • Filename
    6839662