• DocumentCode
    1616716
  • Title

    An upper limit for aggregate I/O interconnect bandwidth of GSI chips constrained by power dissipation

  • Author

    Naeemi, Azad ; Meindl, James D.

  • Author_Institution
    Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2004
  • Firstpage
    157
  • Lastpage
    159
  • Abstract
    For the first time, the average energy dissipation per input/output bits is estimated, which is very useful in determining an upper bound for chip aggregate I/O bandwidth for a given dynamic power budget. Some empirical parameters such as Rent´s parameters and activity factor are used to capture the impact of chip architecture. For a projected multiprocessor implemented at the 45 nm technology node it is shown that 30 Tb/s is the maximum aggregate I/O bandwidth for 100W dynamic power dissipation.
  • Keywords
    integrated circuit interconnections; large scale integration; microprocessor chips; power measurement; 100 W; 45 nm; GSI chips; Rent parameters; activity factor; aggregate I-O bandwidth; energy dissipation; input-output bits; interconnect bandwidth; multiprocessor; power budget; power dissipation; upper bound; upper limit; Aggregates; Bandwidth; Circuit testing; Energy dissipation; Integrated circuit interconnections; Integrated circuit technology; Microelectronics; Optical interconnections; Power dissipation; Upper bound;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International
  • Print_ISBN
    0-7803-8308-7
  • Type

    conf

  • DOI
    10.1109/IITC.2004.1345725
  • Filename
    1345725