DocumentCode
1616716
Title
An upper limit for aggregate I/O interconnect bandwidth of GSI chips constrained by power dissipation
Author
Naeemi, Azad ; Meindl, James D.
Author_Institution
Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2004
Firstpage
157
Lastpage
159
Abstract
For the first time, the average energy dissipation per input/output bits is estimated, which is very useful in determining an upper bound for chip aggregate I/O bandwidth for a given dynamic power budget. Some empirical parameters such as Rent´s parameters and activity factor are used to capture the impact of chip architecture. For a projected multiprocessor implemented at the 45 nm technology node it is shown that 30 Tb/s is the maximum aggregate I/O bandwidth for 100W dynamic power dissipation.
Keywords
integrated circuit interconnections; large scale integration; microprocessor chips; power measurement; 100 W; 45 nm; GSI chips; Rent parameters; activity factor; aggregate I-O bandwidth; energy dissipation; input-output bits; interconnect bandwidth; multiprocessor; power budget; power dissipation; upper bound; upper limit; Aggregates; Bandwidth; Circuit testing; Energy dissipation; Integrated circuit interconnections; Integrated circuit technology; Microelectronics; Optical interconnections; Power dissipation; Upper bound;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International
Print_ISBN
0-7803-8308-7
Type
conf
DOI
10.1109/IITC.2004.1345725
Filename
1345725
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