Title :
On wafer de-embedding for SiGe/BiCMOS/RFCMOS transmission line interconnect characterization
Author :
Tretiakov, Youri ; Vaed, Kunal ; Ahlgren, David ; Rascoe, Jay ; Venkatadri, Sonal ; Woods, Wayne
Author_Institution :
IBM Microelectron., USA
Abstract :
This paper compares different de-embedding techniques for on-wafer transmission line interconnect characterization. The main goal is to contrast and correlate de-embedded S-parameters and extracted electrical characteristics versus industry standard electromagnetic solver results. For the first time the simplified "thru" technique and new "short-open" method are employed for de-embedding on-chip coplanar waveguides over the 0.1-70 GHz frequency bandwidth.
Keywords :
BiCMOS integrated circuits; CMOS integrated circuits; S-parameters; coplanar waveguides; integrated circuit interconnections; radiofrequency integrated circuits; silicon compounds; transmission lines; 0.1 to 70 GHz; BiCMOS; RFCMOS; S-parameters; SiGe; electrical characteristics; industry standard electromagnetic solver; on-chip coplanar waveguides; on-wafer de-embedding techniques; short-open method; transmission line interconnect; BiCMOS integrated circuits; Coplanar transmission lines; Coplanar waveguides; Electric variables; Electromagnetic waveguides; Frequency; Germanium silicon alloys; Scattering parameters; Silicon germanium; Transmission lines;
Conference_Titel :
Interconnect Technology Conference, 2004. Proceedings of the IEEE 2004 International
Print_ISBN :
0-7803-8308-7
DOI :
10.1109/IITC.2004.1345728
