• DocumentCode
    1616841
  • Title

    Functional testing of circuits and SMD boards with limited nodal access

  • Author

    Chin, Kenneth R.

  • Author_Institution
    MIT, Cambridge, MA, USA
  • fYear
    1989
  • Firstpage
    129
  • Lastpage
    143
  • Abstract
    The author describes an approach to testing analog circuits which involves examining their transient response to step inputs in conjunction with multivariable discriminant analysis to determine individual component faults. Assuming the fault spectrum for an individual circuit can be obtained, appropriate pulse input stimuli can be chosen. On the basis of the device´s response to the pulse stimuli, relevant discriminants can be calculated. Together with the fault spectrum, the discriminants could characterize the various device faults, forming a database from which a discriminant analysis could classify such devices on the basis of these discriminants. This approach should yield a substantial savings in component testing time. The feasibility of this method has been examined for a simple circuit, while applications to more complex analog and digital circuit boards and VLSI circuits have been considered
  • Keywords
    VLSI; automatic testing; electronic engineering computing; fault location; integrated circuit testing; printed circuit testing; spectral analysis; statistical analysis; step response; surface mount technology; SMD boards; VLSI circuits; analog circuit boards; analog circuits; automatic testing; component testing time; database; digital circuit boards; error analysis; fault spectrum; feasibility; functional testing; limited nodal access; multivariable discriminant analysis; pulse stimuli; statistical analysis; step inputs; transient response; Circuit faults; Circuit testing; Digital circuits; Instruments; Logic testing; Printed circuits; Probes; Resistors; Very large scale integration; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1989. Proceedings. Meeting the Tests of Time., International
  • Conference_Location
    Washington, DC
  • Type

    conf

  • DOI
    10.1109/TEST.1989.82287
  • Filename
    82287