Title :
High-density nano-pillar SiOx-based resistive switching memory using nano-sphere lithography to fabricate a one diode - one resistor (1D-1R) architecture
Author :
Chang, Y.F. ; Ji, Luyan ; Chen, Yu Christine ; Zhou, Fen ; Tsai, T.M. ; Chang, K.C. ; Chen, Meng Chang ; Chang, T.C. ; Fowler, B. ; Yu, E.T. ; Lee, Jong Chul
Author_Institution :
ECE, Univ. of Texas at Austin, Austin, TX, USA
Abstract :
A highly compact, one diode - one resistor (1D-1R) nano-pillar device architecture has been demonstrated using nano-sphere lithography (NSL) to fabricate SiOx-based resistive switching (RS) memory. The intrinsic SiOx-based resistive switching element and Si-based PN diode are self-aligned on the epitaxial silicon wafer using NSL and a deep-Si-etch process without using conventional photolithography. The DC electrical performance, an AC pulse response in the 50 ns regime, capability for multi-bit operation, and high readout margin immunity for sneak path issue demonstrate good potential for high-speed nonvolatile memory (NVM). The NSL fabrication process is an efficient, economical approach to enable large-scale patterning of 1D-1R architectures while providing excellent NVM performance for future applications.
Keywords :
elemental semiconductors; etching; nanolithography; random-access storage; semiconductor diodes; silicon; silicon compounds; 1D-1R nano-pillar device architecture; AC pulse response; DC electrical performance; NSL fabrication process; NVM; RS memory; Si; SiOx; compact one diode-one resistor architecture fabrication; deep-silicon-etch process; economical approach; epitaxial silicon wafer; high readout margin immunity; high-density nano-pillar -based resistive switching memory; high-speed nonvolatile memory; large-scale patterning; nanosphere lithography; resistive switching element; silicon-based PN diode; time 50 ns; Arrays; Fabrication; Lithography; Nonvolatile memory; Resistors; Silicon; Switches; Nano-Sphere Lithography; Nano-pillar; ReRAM;
Conference_Titel :
VLSI Technology, Systems and Application (VLSI-TSA), Proceedings of Technical Program - 2014 International Symposium on
Conference_Location :
Hsinchu
DOI :
10.1109/VLSI-TSA.2014.6839674