• DocumentCode
    161740
  • Title

    Optical and electronic packaging process for silicon photonic systems

  • Author

    Pavarelli, Nicola ; Jun Su Lee ; Rensing, M. ; Eason, C. ; O´Brien, Peter A.

  • Author_Institution
    Tyndall Nat. Inst., Univ. Coll. Cork, Cork, Ireland
  • fYear
    2014
  • fDate
    21-25 Sept. 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Fibre optic interconnection processes and hybrid integration of electronic devices for high-speed Si photonic systems are presented. An overview of ePIXfab which offers affordable access to an advanced Si photonic foundry service is also presented.
  • Keywords
    elemental semiconductors; integrated optics; integrated optoelectronics; optical fibre couplers; optical interconnections; semiconductor device packaging; silicon; Si; advanced Si photonic foundry service; ePIXfab; electronic devices; electronic packaging; fibre optic interconnection; high-speed Si photonic systems; hybrid integration; optical packaging; silicon photonic systems; Couplers; Couplings; Integrated circuits; Optical fibers; Packaging; Photonics; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optical Communication (ECOC), 2014 European Conference on
  • Conference_Location
    Cannes
  • Type

    conf

  • DOI
    10.1109/ECOC.2014.6964237
  • Filename
    6964237
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=161740