Planar microwave circuits employing double vertical interconnects for analogue processing of ultrawideband signals

The paper presents the design of novel planar microwave circuits for analogue processing of ultrawideband (3.1 to 10.6 GHz) signals. The proposed structures include power dividers, phase shifters and 90° and 180° hybrid circuits. They are accomplished in single-layer dielectric substrate. Through the use of double wireless vertical interconnects, which utilize two conducting substrate sides, these components are compatible with ordinary microwave circuits making them suitable for easy integration of microwave front ends. The presented designs are verified using full-wave electromagnetic field analysis and experimental tests.