• DocumentCode
    1617600
  • Title

    A passive RFID tag IC development platform

  • Author

    Hong, Yang ; Ng, Yuen Sum ; Chan, Chi Fat ; Guo, Jianping ; Shi, Weiwei ; Ho, Marco ; Ai, Yanqing ; Mak, Ki-Leung ; Leung, Ka Nang ; Choy, Chiu Sing ; Pun, Kong Pang ; Leung, Lincoln Lai Kan

  • Author_Institution
    Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, China
  • fYear
    2009
  • Firstpage
    286
  • Lastpage
    289
  • Abstract
    This paper presents a development platform to generate passive UHF RFID tags compatible with EPCTM C1G2 protocol. The platform is based on one RFID tag IC prototype implemented in a 130nm CMOS technology. Some features of the tag IC include that a voltage multiplier implemented by diode-connected NMOSFETs, a voltage regulator composed of a self-biased mutual compensation without large resistors for area-saving, and an energy-aware irregular clock structure with clock gating used in the baseband processor. To further reduce the chip area for low production cost and meet different specifications, the platform design manages to achieve different floorplans according to different user-defined requirements, mainly focusing on the communicating distances. This approach simplifies the design flow, and, most importantly, shortens time-to-market.
  • Keywords
    CMOS integrated circuits; MOSFET; clocks; radiofrequency identification; resistors; CMOS technology; EPCTM C1G2 protocol; baseband processor; clock gating; diode-connected NMOSFET; energy-aware irregular clock structure; passive RFID tag IC development platform; passive UHF RFID tags; resistors; self-biased mutual compensation; voltage regulator; CMOS integrated circuits; CMOS technology; Clocks; Diodes; MOSFETs; Passive RFID tags; Protocols; Prototypes; RFID tags; Voltage; baseband processor; reconfigurable RFID; voltage multiplier; voltage reference;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Anti-counterfeiting, Security, and Identification in Communication, 2009. ASID 2009. 3rd International Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-3883-9
  • Electronic_ISBN
    978-1-4244-3884-6
  • Type

    conf

  • DOI
    10.1109/ICASID.2009.5276902
  • Filename
    5276902