Repair machine for integrated circuits using laser-induced microchemistry

Author

Gerard, Jean J.

Author_Institution

Bertin SA, Les Milles, France

fYear

1988

Firstpage

177

Abstract

Summary form only given. Design mistakes may appear during the validation steps of integrated circuits. Designers need a machine able to modify the interconnection network in an IC prototype during tests. A repair process by laser direct writing of microstructure was achieved via local decomposition of gases in submicron areas on IC chips. Experimental procedures for conductor (Ni) or insulator (Si/sub 3/N/sub 4/) deposition and microelectronic material (SiO/sub 2/-Al) etching were defined. This work led to a VLSI repair machine gathering all these elementary reactions in one process, allowing designers to modify quickly and efficiently interconnection networks.<>

Keywords

VLSI; aluminium; chemical vapour deposition; etching; integrated circuit technology; laser beam applications; nickel; silicon compounds; Al etching; IC chips; IC prototype; IC validation; Ni deposition; Si/sub 3/N/sub 4/ deposition; SiO/sub 2/ etching; VLSI repair machine; conductor deposition; conductor etching; design error correction; insulator deposition; insulator etching; interconnection network modification; laser beam etching; laser direct write repair; laser-induced microchemistry; local decomposition of gases; prototype chip repair; repair process by laser direct writing; submicron areas; validation steps; Circuit testing; Conducting materials; Gas lasers; Insulation; Integrated circuit testing; Microstructure; Multiprocessor interconnection networks; Prototypes;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1988, Design-to-Manufacturing Transfer Cycle. Fifth IEEE/CHMT International

Conference_Location

Lake Buena Vista, FL, USA

Type

conf

DOI

10.1109/EMTS.1988.16171

Filename

16171