DocumentCode
1618403
Title
TCAD and SPICE modeling help solve ESD protection issues in analog CMOS technology
Author
Trémouilles, D. ; Bertrand, G. ; Bafleur, M. ; Beaudoin, F. ; Perdu, P. ; Lescouzères, L.
Author_Institution
ON Semicond., Toulouse, France
Volume
2
fYear
2002
fDate
6/24/1905 12:00:00 AM
Firstpage
749
Abstract
The number of circuit design iterations due to electrostatic discharge (ESD) failures increases with the complexity of VLSI technologies and the shrinkage of their dimensions. In this paper, we show how TCAD and ESD SPICE modeling can be used to solve ESD protection issues in an analog CMOS technology.
Keywords
CMOS analogue integrated circuits; SPICE; circuit CAD; electrostatic discharge; integrated circuit design; integrated circuit modelling; protection; technology CAD (electronics); ESD protection; IC design rules; SPICE modeling; TCAD; VLSI technology complexity; analog CMOS technology; circuit design iterations; electrostatic discharge failures; CMOS technology; Circuits; Design methodology; Electrostatic discharge; MOS devices; Protection; SPICE; Semiconductor device modeling; Stress; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics, 2002. MIEL 2002. 23rd International Conference on
Print_ISBN
0-7803-7235-2
Type
conf
DOI
10.1109/MIEL.2002.1003366
Filename
1003366
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