Title :
Semiconductor back end manufacturing process — ESD capability analysis
Author :
Yan, K.P. ; Gaertner, Reinhold ; Wong, C.Y.
Author_Institution :
Infineon Technol. (Malaysia) Sdn. Bhd., Batu Berendam, Malaysia
Abstract :
The demand for ESD control in the semiconductor industry has become more and more stringent especially from customers within the automotive industry segment. The requirement for an ESD capability analysis for the whole manufacturing process line is no longer an option. This paper provides an overview of an ESD capability/risk analysis in a semiconductor back end manufacturing process. The challenges encountered in the analysis and the solutions are provided.
Keywords :
electrostatic discharge; risk analysis; semiconductor industry; ESD control; automotive industry; risk analysis; semiconductor back end manufacturing process; semiconductor industry; Cleaning; Electrostatic discharges; Resistance; Sawing; Silicon; Voltage measurement;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2013 35th
Conference_Location :
Las Vegas, NV
