Title :
Mutual ballasting: A novel technique for improved inductive system level IEC ESD stress performance for automotive applications
Author :
Salman, Adnan Ahmed ; Farbiz, Farzan ; Concannon, Ann ; Edwards, Hal ; Boselli, G.
Author_Institution :
Texas Instrum., Dallas, TX, USA
Abstract :
A new ESD failure mode under inductive IEC stress of automotive CAN pins is identified. Inductor saturation causes increase of the rise-time from ins to ~20ns, leading to non-uniform conduction in the bidirectional ESD circuit. A new mutual ballasting layout technique is introduced to recover the system level ESD performance.
Keywords :
automotive electronics; electrostatic discharge; failure analysis; ESD failure mode; IEC ESD stress performance; automotive CAN pins; bidirectional ESD circuit; inductive IEC stress; inductive system level; inductor saturation; mutual ballasting layout technique; system level ESD performance; Electrostatic discharges; Fingers; Hidden Markov models; IEC; Inductors; Stress; Thyristors;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2013 35th
Conference_Location :
Las Vegas, NV
