DocumentCode
1620175
Title
Micromirror based Lithography Simulation System based on Overlay Intensity Basis
Author
Park, Kiwon ; Choi, Jaeman ; Kim, Haeryung ; Seo, Manseung
Author_Institution
Inst. of Adv. Mechatronics for Thinfilm Eng. Needs, Busan
fYear
2006
Firstpage
2168
Lastpage
2173
Abstract
To generate proper patterns for micromirror based lithography, millions of micromirrors need to be addressed and adjusted, individually and instantaneously. In this study, a strategy for micromirror based lithography simulation is proposed. Accounting for the instantaneous distribution of the light energy from a rotated micromirror onto a translating substrate, the overlay intensity basis is defined as the three-dimensional pattern image upon the accumulation of irradiated energy by a unit micromirror per unit translating phase. A prototype lithography simulation system for generating lithographic data and predicting the lithography results is implemented upon the overlay intensity basis. To ensure the system works, parallel with the simulation, actual lithography is performed on prototype equipment to fabricate actual wafers. The overall results of the simulations and experiments show consistency, both physically and mathematically. The properness of the proposed strategy for micromirror based lithography simulation and the precision of the implemented lithography simulation system are ensured
Keywords
micromirrors; optical fabrication; photolithography; energy accumulation; instantaneous light energy distribution; lithographic data; lithography simulation system; micromirror; overlay intensity basis; rotated micromirror; three-dimensional pattern image; wafers fabrication; Circuit simulation; Digital control; Fabrication; Lithography; Mechatronics; Micromirrors; Optical reflection; Predictive models; Substrates; Virtual prototyping; Digital Micromirror Device; Lithography Experiment; Lithography Simulation; Maskless Lithography;
fLanguage
English
Publisher
ieee
Conference_Titel
SICE-ICASE, 2006. International Joint Conference
Conference_Location
Busan
Print_ISBN
89-950038-4-7
Electronic_ISBN
89-950038-5-5
Type
conf
DOI
10.1109/SICE.2006.315643
Filename
4109047
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