DocumentCode
1620304
Title
Workshop and panel discussions
Author
Wong, Rita ; Miller, Jason ; Vinson, Jim ; Vashchenko, Vladislav ; Anderson, Willie ; Smedes, T. ; Karp, Jann ; Pelc, Tom ; Kinnear, John ; Monroe, Gene ; Peachey, Nathaniel ; Gossner, Harald ; Caignet, Fabrice ; Klein, David ; Stadler, Wolfgang ; Johnson
fYear
2013
Firstpage
1
Lastpage
6
Abstract
Summary form only given. Have you ever wondered how other companies organize their ESD design teams? Join us as we attempt to benchmark successful organization strategies as practiced by Workshop participant companies. We expect divergent opinions and a healthy debate on the advantages and disadvantages of the various approaches. Is your ESD design team embedded within an I/O design team, or independent? Are you in a central technology support organization, or in a product group? Does your company leverage outside ESD design contractors? Does your ESD design team organization drive your ESD support model? For example are ESD design solutions full custom for each I/O library, or offered as generic solutions in a process technology? Do you have separate engineers for ESD IP design and SoC support? How many IP sets or SoCs is each engineer expected to support? This Workshop should give you valuable insight into industry ESD team organization strategies to discuss with your work peers and managers.
Keywords
electrostatic discharge; integrated circuit design; logic design; product design; system-on-chip; ESD IP design; ESD design contractors; ESD design solutions; ESD design teams; ESD support model; I/O design team; I/O library; IP sets; SoC support; central technology support organization; generic solutions; organization strategies; panel discussions; process technology; product group; workshop participant companies; Conferences; Earth Observing System; Electrostatic discharges; Manufacturing; Organizations; Robustness; System-on-chip;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2013 35th
Conference_Location
Las Vegas, NV
ISSN
0739-5159
Type
conf
Filename
6635953
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