Title :
Design and technology of flip chip and SMD devices integrated with LTCC module
Author :
Jurków, Dominik ; Malecha, Karol ; Czok, Mateusz ; Roguszczak, Henryk ; Babiarz, Michal ; Golonka, Leszek
Author_Institution :
Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wrocław, Poland
Abstract :
Electrical circuit design and technology of flip chip audio amplifier integrated with LTCC module are presented in the paper. Electrical circuit layout was miniaturized. Interconnections reliability between chip and substrate were increased with special underfill. Bonding quality was analyzed with X-Ray inspection. All electronic components were encapsulated with special ceramic housing. Additionally technology of LTCC modules integrated with RF transmitters and receivers are presented in the paper.
Keywords :
audio-frequency amplifiers; ceramic packaging; flip-chip devices; integrated circuit bonding; integrated circuit layout; surface mount technology; RF receivers; RF transmitters; SMD devices; X-ray inspection; electrical circuit design; electrical circuit layout; flip-chip audio amplifier; integrated LTCC module; interconnections reliability; Ceramics; Flip chip; Integrated circuit interconnections; Nonhomogeneous media; Substrates; Temperature sensors; LTCC; SIP; X-Ray; flip chip; thick-film;
Conference_Titel :
Mixed Design of Integrated Circuits and Systems (MIXDES), 2010 Proceedings of the 17th International Conference
Conference_Location :
Warsaw
Print_ISBN :
978-1-4244-7011-2
Electronic_ISBN :
978-83-928756-4-2
