DocumentCode
1620919
Title
Simple technique for improving the hot-carrier reliability of single-poly bipolar transistors
Author
Kosier, S.L. ; DeLaus, M. ; Wei, A. ; Schrimpf, R.D. ; Martinez, A.
Author_Institution
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
fYear
1994
Firstpage
205
Lastpage
208
Abstract
It is shown experimentally and through simulation that reduced screen oxide thickness leads to increased breakdown voltage of the emitter-base junction (BVebo) and reduced peak electric field at breakdown, which translates into improved hot-carrier reliability. The effect of reduced screen oxide thickness on the peak cutoff frequency is minimal. For these devices, thinning the screen oxide from 55 to 35 nm increases BVebo by 0.2 V, improves the hot-carrier-induced excess base current by more than an order of magnitude at a base-emitter voltage of 0.6 V, and degrades the peak cutoff frequency by only 3 percent
Keywords
hot carriers; 0.6 V; 35 nm; Si; base-emitter voltage; breakdown voltage; emitter-base junction; excess base current; hot-carrier reliability; peak cutoff frequency; peak electric field; screen oxide thickness; single-poly bipolar transistors; BiCMOS integrated circuits; Bipolar transistors; Breakdown voltage; Cutoff frequency; Degradation; Electric breakdown; Hot carriers; Impurities; Lead compounds; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Bipolar/BiCMOS Circuits and Technology Meeting,1994., Proceedings of the 1994
Conference_Location
Minneapolis, MN
Print_ISBN
0-7803-1316-X
Type
conf
DOI
10.1109/BIPOL.1994.587895
Filename
587895
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