Title :
Temperature fields and reliability of thick-film components under pulse mode operation
Author :
Nowak, Damian ; Plawski, Szymon ; Dziedzic, Andrzej
Author_Institution :
Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wrocław, Poland
Abstract :
This paper presents experimental studies on temperature fields distribution in thick-film and LTCC (Low Temperature Co-fired Ceramics) microcircuits with heat sources represented by resistors and their reliability under pulse loads. Thermographic scanning system based infrared detector was applied for thermal mapping of components and digital multimeter was used for carrying out ageing tests. Obtained results give practical information about possible applications of such components in microelectronic circuits and their reliability in different working conditions.
Keywords :
ageing; digital multimeters; infrared detectors; integrated circuit reliability; resistors; temperature distribution; thick film circuits; LTCC microcircuits; digital multimeter; heat sources; infrared detector; low temperature co-fired ceramics; microelectronic circuits; pulse loads; pulse mode operation; resistors; temperature fields; temperature fields distribution; thermal mapping; thermographic scanning system; thick-film components reliability; Microelectronics; Resistors; Substrates; Temperature distribution; Temperature measurement; Thermal conductivity; LTCC; microcircuit; reliability; resistor; temperature distribution; thick-film;
Conference_Titel :
Mixed Design of Integrated Circuits and Systems (MIXDES), 2010 Proceedings of the 17th International Conference
Conference_Location :
Warsaw
Print_ISBN :
978-1-4244-7011-2
Electronic_ISBN :
978-83-928756-4-2
