Title :
Proceedings. 1998 IEEE Symposium on IC/Package Design Integration (Cat. No.98CB36211)
Abstract :
The following topics were dealt with. Logic and memory ICs; IC interconnections; high-level design; flip-chip devices; RF-wireless applications; package design; and IC modelling
Keywords :
digital integrated circuits; flip-chip devices; high level synthesis; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; IC interconnections; IC modelling; RF-wireless applications; flip-chip devices; high-level design; logic ICs; memory ICs; package design;
Conference_Titel :
IC/Package Design Integration, 1998. Proceedings. 1998 IEEE Symposium on
Conference_Location :
Santa Cruz, CA, USA
Print_ISBN :
0-8186-8433-X
DOI :
10.1109/IPDI.1998.663610
