Thermal issues in microelectronics

fYear

2010

Firstpage

349

Lastpage

350

Abstract

Start of the above-titled section of the conference proceedings record.

fLanguage

English

Publisher

ieee

Conference_Titel

Mixed Design of Integrated Circuits and Systems (MIXDES), 2010 Proceedings of the 17th International Conference

Conference_Location

Warsaw

Print_ISBN

978-1-4244-7011-2

Type

conf

Filename

5551682

Link To Document