• DocumentCode
    1621582
  • Title

    Ion Energy Distributions in Multifrequency Capacitive Discharges

  • Author

    Wu, Alan C. ; Lieberman, Michael A. ; Verboncoeur, John P.

  • Author_Institution
    California Univ., Berkeley
  • fYear
    2007
  • Firstpage
    466
  • Lastpage
    466
  • Abstract
    Summary form only given. Capacitive discharges are widely used for thin-film processing of silicon and flat-panel substrates in the microelectronics industry. The ion energy distribution (ED) at the substrate surface is an important parameter in these processes. Multiple frequency drives are often used to control the width and the average of the IED. The physics of IED formation in low pressure single frequency capacitive discharges is fairly well understood. However, the understanding of multiple frequency driven discharges is less than adequate. In this work, an analytical model of the IED is developed and compared to simulations using a kinetic, particle-in-cell (PIC), Monte Carlo collision (MCC) method. To determine the IED in the model, given the sheath voltage waveform V(t), the frequency spectrum E(f) of a time-varying ion energy response is first determined as E(f)=T(f)V(f), where T(f) is a frequency transfer (filter) function and V(f) is the frequency spectrum of the sheath voltage waveform. After applying an inverse Fourier transformation of E(f) to determine E(t), the IED within a certain small energy interval is determined as proportional to the total time for E(t) to lie within that energy interval. Various transfer functions are explored, all chosen such that the ions completely respond to low frequency oscillations and have a 1/f response at high frequencies. In the simulations, done in argon with a discharge gap of 3 cm, the IED is collected over many cycles of the lowest frequency. The gap is divided into 500 cells and the simulation time step is 7.63 ps, chosen in order to resolve the Debye length and fulfill simulation stability criteria. Initial simulations are done neglecting ion-neutral charge transfer and elastic scattering collisions, using single, dual, and triple frequency excitation over a wide voltage range, with various commensurate or incommensurate frequency ratios. The models and simulation results are generally in good agreement. In - later analysis and simulations, the effects of ion-neutral collisions in the sheath on ion and fast neutral energy distributions at the substrate surface are examined.
  • Keywords
    Fourier transforms; Monte Carlo methods; capacitors; electric breakdown; plasma sheaths; plasma transport processes; Debye length; IED average; IED width; Monte Carlo collision method; distance 3 cm; dual frequency excitation; flat panel substrates; frequency transfer function; inverse Fourier transformation; ion energy distribution; ion energy frequency spectrum; kinetic PIC MC collision methd; multifrequency capacitive discharge; multifrequency driven discharge; particle in cell method; sheath voltage waveform frequency spectrum; silicon substrates; simulation stability criteria; single frequency excitation; substrate surface IED; thin film processing; time 7.63 ps; triple frequency excitation; Analytical models; Frequency; Kinetic theory; Microelectronics; Physics; Semiconductor thin films; Silicon; Substrates; Surface discharges; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science, 2007. ICOPS 2007. IEEE 34th International Conference on
  • Conference_Location
    Albuquerque, NM
  • ISSN
    0730-9244
  • Print_ISBN
    978-1-4244-0915-0
  • Type

    conf

  • DOI
    10.1109/PPPS.2007.4345772
  • Filename
    4345772