• DocumentCode
    1622379
  • Title

    Electrode Placement During Stimulus Evoked Electromyographic Monitoring of Iliosacral Screw Insertion: A Finite Element Model

  • Author

    Kopec, Michael A. ; Moed, Berton R. ; Barnett, David W.

  • Author_Institution
    Dept. of Biomedical, Saint Louis Univ., MO
  • fYear
    2006
  • Firstpage
    3653
  • Lastpage
    3655
  • Abstract
    Stimulus evoked electromyography is currently used during surgery to prevent nerve root injury during iliosacral screw insertion. In order to evaluate the importance of anode location in this procedure, a three dimensional finite element model was constructed from computed tomography data to evaluate the effectiveness of five electrode locations. Three anode locations (CASIS, dorsal midline and ventral midline) performed well, including the one most commonly used clinically (ventral midline). The dorsal midline, ventral midline, and CASIS anode locations provide data on the proximity to the neural structure in the superior, inferior and contralateral directions respectively that were attenuated at other anode locations. Modification of the technique to include monitoring of multiple anode locations could further reduce the incidence of injury
  • Keywords
    biomedical electrodes; computerised tomography; electromyography; finite element analysis; patient monitoring; surgery; CASIS anode location; computed tomography; dorsal midline anode location; electrode placement; electromyography; finite element model; iliosacral screw insertion; nerve root injury; stimulus evoked electromyographic monitoring; surgery; ventral midline anode location; Anodes; Computed tomography; Electrodes; Electromyography; Fasteners; Finite element methods; Injuries; Monitoring; Orthopedic surgery; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2005. IEEE-EMBS 2005. 27th Annual International Conference of the
  • Conference_Location
    Shanghai
  • Print_ISBN
    0-7803-8741-4
  • Type

    conf

  • DOI
    10.1109/IEMBS.2005.1617274
  • Filename
    1617274