Title :
Thermal monitoring of safety-critical integrated systems
Author :
Székely, V. ; Rencz, M. ; Karam, J.M. ; Lubaszewski, M. ; Courtois, B.
Author_Institution :
Dept. of Electron Devices, Tech. Univ. Budapest, Hungary
Abstract :
On-line temperature monitoring of safety-critical ICs and systems becomes more and more crucial because of downsizing of integrated circuits and of increased density due to advanced packaging. To prevent erroneous operation, temperature sensors should be placed on the critical spots, the outputs of which should be read by means of boundary scanned architectures or modified boundary scanned architectures in case of on-line monitoring
Keywords :
CMOS analogue integrated circuits; boundary scan testing; built-in self test; integrated circuit testing; microsensors; production testing; temperature sensors; thermistors; thermocouples; CMOS temperature sensors; boundary scanned architectures; critical spots; design for thermal testability; integrated microsensor; modified boundary scanned architectures; on-line temperature monitoring; process compatibility; safety-critical IC; safety-critical integrated systems; self-checking systems; sensor placement strategies; thermal monitoring; thermal production testing; thermistors; thermocouples; thermoresistors; unified BIST; Circuit testing; Monitoring; Semiconductor materials; Sensor phenomena and characterization; Sensor systems; System testing; Temperature measurement; Temperature sensors; Thermal sensors; Thermoresistivity;
Conference_Titel :
Test Symposium, 1996., Proceedings of the Fifth Asian
Conference_Location :
Hsinchu
Print_ISBN :
0-8186-7478-4
DOI :
10.1109/ATS.1996.555172
