Thermal monitoring of safety-critical integrated systems

Author

Székely, V. ; Rencz, M. ; Karam, J.M. ; Lubaszewski, M. ; Courtois, B.

Author_Institution

Dept. of Electron Devices, Tech. Univ. Budapest, Hungary

fYear

1996

Firstpage

282

Lastpage

288

Abstract

On-line temperature monitoring of safety-critical ICs and systems becomes more and more crucial because of downsizing of integrated circuits and of increased density due to advanced packaging. To prevent erroneous operation, temperature sensors should be placed on the critical spots, the outputs of which should be read by means of boundary scanned architectures or modified boundary scanned architectures in case of on-line monitoring

Keywords

CMOS analogue integrated circuits; boundary scan testing; built-in self test; integrated circuit testing; microsensors; production testing; temperature sensors; thermistors; thermocouples; CMOS temperature sensors; boundary scanned architectures; critical spots; design for thermal testability; integrated microsensor; modified boundary scanned architectures; on-line temperature monitoring; process compatibility; safety-critical IC; safety-critical integrated systems; self-checking systems; sensor placement strategies; thermal monitoring; thermal production testing; thermistors; thermocouples; thermoresistors; unified BIST; Circuit testing; Monitoring; Semiconductor materials; Sensor phenomena and characterization; Sensor systems; System testing; Temperature measurement; Temperature sensors; Thermal sensors; Thermoresistivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Symposium, 1996., Proceedings of the Fifth Asian

Conference_Location

Hsinchu

ISSN

1085-7735

Print_ISBN

0-8186-7478-4

Type

conf

DOI

10.1109/ATS.1996.555172

Filename

555172