• DocumentCode
    1623096
  • Title

    Output buffer with self-adjusting slew rate and on-chip compensation

  • Author

    Lim, Chee How ; Daasch, W. Robert

  • Author_Institution
    Portland Technol. Dev., Intel Corp., USA
  • fYear
    1998
  • Firstpage
    51
  • Lastpage
    55
  • Abstract
    In this paper, two circuits are proposed to effectively control IC noise. The first circuit is a modified I/O circuit that monitors the local output switching condition, and intelligently adjusts its slew rate such that the I/O can switch as fast as it is allowed without jeopardizing noise performance. The second circuit is a PVT-compensation control circuit, which senses process, voltage, and temperature variations, and compensates the I/O circuit´s current drive accordingly. This feature makes the I/O circuits more robust under a range of environmental stresses. From analyses and simulations, the proposed I/O and PVT-compensation control circuits demonstrate robustness in terms of IC noise control. They control IC noise to less than 10% variation between single and multiple output switchings as compared to a conventional I/O circuit with 56% variation
  • Keywords
    buffer circuits; circuit analysis computing; compensation; integrated circuit design; integrated circuit modelling; integrated circuit noise; switching; I/O circuit; I/O circuit current drive compensation; I/O circuits; I/O switching speed; IC noise control; IC noise control circuits; PVT-compensation control circuit; environmental stresses; local output switching condition monitoring; modified I/O circuit; multiple output switching; noise performance; on-chip compensation; output buffer; process variations; self-adjusting slew rate; single output switching; slew rate; temperature variations; voltage variations; Analytical models; Integrated circuit noise; Noise robustness; Stress; Switches; Switching circuits; Temperature control; Temperature sensors; Voltage control; Working environment noise;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    IC/Package Design Integration, 1998. Proceedings. 1998 IEEE Symposium on
  • Conference_Location
    Santa Cruz, CA
  • Print_ISBN
    0-8186-8433-X
  • Type

    conf

  • DOI
    10.1109/IPDI.1998.663621
  • Filename
    663621